Optimization of the Desktop CPU's Straight Heatsink via CFD Simulation by Solidworks Flow Simulation

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Published Jun 24, 2025
https://doi.org/10.56158/jpte.2025.113.4.01
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Vol. 4 No. 01 (2025): June

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Md Nazmul Hasan Dipu
Department of Industrial and Production Engineering, Shahjalal University of Science and Technology, Sylhet, Bangladesh.
https://orcid.org/0000-0001-6838-4918
Mahbub Hasan Apu
Department of Electrical and Electronic Engineering, Sylhet Engineering College, Sylhet, Bangladesh.
https://orcid.org/0009-0004-5805-1561
Pritidipto Paul Chowdhury
Department of Industrial and Production Engineering, Shahjalal University of Science and Technology, Sylhet, Bangladesh.
https://orcid.org/0009-0004-2618-268X

Abstract

The straight heatsink is one of the most common heat transfer components used in desktop CPUs to manage the heat generated by the microprocessor. The study aimed to find the optimal fin numbers of the straight heatsink for three different fin thicknesses and compare the masses at these points. For the analysis, the present study used Solidworks® software to create CAD models and perform the CFD simulation. It was found that each of the three different fin thicknesses had a turning point at which the microprocessor’s temperature was at its minimum. The weight of the heatsink was also measured at those turning points. Specifically, the heatsinks with 1 millimeter, 1.5 millimeters, and 2 millimeters thickness had a microprocessor temperature of about 83.52 degrees Celsius, 86.50 degrees Celsius, and 89.25 degrees Celsius, with the weight of approximately 307.80 grams, 388.80 grams, and 448.2 grams. Overall, a 1-millimeter fin thickness with 21 fins configuration for this study was best under the criteria of minimum microprocessor temperature and minimum heatsink mass. Thus, this study successfully demonstrated that optimization of mass and fin thickness of the heatsink was possible to provide better thermal management of the microprocessors of a desktop’s CPU. This study is significant for this era because it provides a panacea for minimum material cost, lightweight, and minimum microprocessor temperature.

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This work is licensed under a Creative Commons Attribution-NonCommercial 4.0 International License.

How to Cite
Dipu, M. N. H., Apu, M. H. ., & Chowdhury, P. P. (2025). Optimization of the Desktop CPU’s Straight Heatsink via CFD Simulation by Solidworks Flow Simulation. International Journal of Pioneering Technology and Engineering, 4(01), 1–16. https://doi.org/10.56158/jpte.2025.113.4.01

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